Business
반도체장비
NBK-106/107
Full Automatic Sapphire Breaker System
Fully Automated Wafer Breaking Series
- Sapphire wafer breaking system for LED chip separation
Powerful Breaking Engine
- NEONTECH’s unique breaking blade synchronized with electrical small hammer. Breaking speed and hammer hit force is controlled and optimized for various laser scribing condition.
Various Function
- Multiple align & breaking method(continuous or odd/even breaking) Broken wafer semi automatic breaking.
User Interface
- Multi language such as Korea / English / Chinese / Japanese Is provided for user’s convenience. Also, system provide wide(17”) screen.
상세설명
SPECIFICATIONS
| Specification | Unit | NBK-106H | NBK-107H | |
| Workpiece size | Inch | Φ4” | Φ6” | |
| X-axis | Moving Range | mm | 0.01 – 110 | 0.01 – 160 |
| Moving Speed | mm/sec | 0.1 – 400 | ||
| Y-axis | Indexing Range | mm | 110 | 160 |
| Y-Single Pitch Error | mm | 0.002/5 | ||
| Y-Positioning Error | mm | 0.002/110 | 0.002/160 | |
| Min.Step | mm | 0.0001 | ||
| Z-axis | Max Stroke | mm | 100 | |
| Moving Resolution | mm | 0.00005 | ||
| Repeatability accuracy | mm | 0.001 | ||
| Θ-axis | Max Rotation Angle | deg | 360 | |
| Support Axis | Work Range | mm | 45 | 65 |
| Resolution | mm | 0.001 | ||
| Machine Dimensions(WxDxH) | mm | 1,050 x 1,080 x 1,800 | 1,190 x 1,200 x 1,800 | |
| Machine Weight | kg | 800 | 1,000 | |
