Business
Business
Wafer Cleaner
반도체장비
NSDA-6000
(a) System introduction.
- 8”,12”Wafer wet spin cleaning
- Low level Clean room (10~100 class)
(b) System summary.
- 8”12”simple Conversion
- Dual spin cleaning UPH UP.
- Cleaning condition Optimize nozzle
- D.I Wafer jet type Cleaning (Co2 Bubbler)
(c) System dimension.
- 1,420x1,900x1,850mm(W x D x H)
상세설명
SPECIFICATIONS
| Specification | Unit | NSDA-6000 | |
| Workpiece Size | Cassettes | Inch | 8” cassettes / 12”cassettes |
| Frame | Inch | 8”,12” | |
| Cleaning target | Work Range | mm | 200~300 |
| Actuator Type | - | Clean type | |
| S-Axis | Cleaning Area | mm | Max 300 |
| Max Speed | rpm | Max 2,500 | |
| Nozzle | Work Range | Inch | Max 12” Within the area UI control |
| Nozzle Type | - | Air Blow, Air Atomizing | |
| Nozzle Moving Parameter | - | Speed & angle | |
| Options | Air Volume (Max) | cmm | 3.5 |
| Air Velocity (Max) | m/s | 0.2 | |
| Utilities | Power | vac | 220VAC – 3P - 30A 50/60Hz |
| Air Pressure | kg/cm2 | 5 ~ 6 | |
| Water Pressure | kg/cm2 | 3 ~ 4 | |
| Exhaust | m3/min | >50 | |
| Suction Motor | m3/min | >28 x 2ea | |
| Weight | kg | @ 1,300 | |
| Size(W x D x H)mm | mm | 1,300x1,900x1,900 | |