Business
Business
ETC
반도체장비
NTM Series
Manual Wafer/Substrate Mounting System
NTM-80
- Manual wafer /substrate mounting system to ring frame.
- Spring tension mechanism on chuck to prevent material damage.
Work Flow
- Loading (Wafer & Ring frame) → Tape mounting → Tape cutting → Unloading
Main Features
- 6” & 8” wafer(NTM-60/80) or substrate mounting
- Manual tape mounting & cutting
- Tape tension control(Anti tape loosen)
- Cover tape auto rewinding
- Temperature programmable chuck (Vacuum chuck)
- Spring tension mechanism on chuck to prevent wafer broken
상세설명
SPECIFICATIONS
| No. | Items | Specifications |
| 1 | Material size | ø200mm |
| 2 | Temperature control | 30 ~ 60 degr |
| 3 | Material surface protection | Vacuum chuck teflon coating |
| 4 | Tape max width | 330mm |
| 5 | Cover film | Auto rewinding function |
| 6 | dimension (W x D x H) | 420 x 800 x 370mm |
| 7 | Weight | 35 Kg |
| 8 | Lamp life time | 3,000H |
| 9 | Vacuum | 0.3 MPa |
| 10 | Electricity | 220V 50/60Hz 15A |
